Simultaneous Double Side Grinding Of Silicon Wafers A
2006-8-1ensp0183enspIn SSG, as shown in Fig. 3, a silicon wafer is held on a porous ceramic chuck by means of vacuum. The grinding wheel is a diamond cup wheel. The grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis 9,12,13. After the wafer front side is ground, the grinder.